New platform integrates multiphysics analysis across chip, package and photonic design workflows to support advanced semiconductor and multi-die systems. Synopsys has announced the availability of the ...
Abstract: Self-heating of the device will intensify the thermo-mechanical effects, leading to an increase in thermal stress. Currently, most of the research focuses on strain engineering of the device ...
Abstract: To improve the reliability of high speed permanent magnet machines (HSPMMs) under multiphysics constraints, including the electromagnetic properties, losses, rotor stress, rotor dynamics, ...
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