Abstract: This paper introduces the packaging and characterization of a novel die-integrated PCB SiC MOSFET half-bridge module. Due to the use of standard PCB technology, the proposed module is ...
Providing power via contact-closure circuits historically required a new third wire, but perhaps no longer. Say the words “solid-state relay” (SSR) and most engineers also naturally think of two ...
A telecom startup brought us a 20-layer HDI PCB with 56 Gbps PAM4 SerDes links routed across 5 inches of FR-4. Their BER was catastrophic. The fab wasn't the problem. The substrate choice was. The gap ...
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