Abstract: Power electronics cooling has always been dependent on thermal interface materials (TIM) between semiconductor modules (Power modules, IGBT's, Diodes, etc) and cold plates. Increased product ...
Abstract: To meet the stringent performance of electric vehicle controllers, it is highly needed to optimize the electrical and thermal performance of power semiconductor modules. As stacked direct ...
BEIJING—The worldwide surge in demand for artificial intelligence is driving a wave of exports from China, keeping the world’s second-largest economy humming despite turmoil from the war in Iran.
Half-bridge series for data centre power converters and industrial motor drives features low RDSon SiC MOSFETs and parallel SBD diodes SemiQ , a US developer of SiC solutions, has expanded its QSiC ...
Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it has jointly developed a new standard package for power modules with integrated 3-level circuits, designed for industrial drive ...
TOKYO, June 08, 2026--(BUSINESS WIRE)--Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it has jointly developed a new standard package for power modules with integrated 3-level ...
Computex shows AI ecosystem; fully autonomous chip design; Intel targets AI racks; Nikon’s 1.5 micron L/S litho; IC market rises; Apple’s chiplet era; 4,500 chips per AI server rack; HBM price hikes; ...
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